Tension-Band Wiring Versus Plate Fixation for Olecranon Fractures: A Narrative Review

Authors

  • Reda Hussein Mahmoud Hussein Elkady, Nagy Mohamed Fouda El-Naggar, Haytham Abdelaziz Sadek Abo-Elhassan, Ahmed Salah Ali Awad Ghorab

Abstract

Background: Olecranon fractures are intra-articular injuries influenced by the subcutaneous location of the olecranon and the distractive forces of the triceps. Operative fixation commonly relies on tension-band wiring or plate fixation, but each technique has distinct biomechanical advantages and complication profiles.

Objective: This narrative review summarizes the epidemiology, anatomy, classification, diagnosis, treatment principles, surgical techniques, functional outcomes, complications, and clinical selection of tension-band wiring and plate fixation for olecranon fractures.

Review: Tension-band wiring is inexpensive and remains appropriate for simple transverse Mayo type IIA fractures with good bone quality and minimal comminution. Its effectiveness depends on accurate reduction, parallel Kirschner-wire placement, secure anchorage, and proper tensioning of the figure-of-eight wire. Hardware prominence, wire migration, loss of reduction, and implant removal remain important limitations. Plate fixation provides rigid, fixed-angle stability and is particularly useful for comminuted, oblique, osteoporotic, and unstable fracture patterns. Modern pre-contoured and low-profile plates improve construct versatility, although hardware irritation, wound complications, and higher implant cost remain concerns.

Conclusion: Both techniques can provide reliable union and satisfactory function when appropriately selected and correctly performed. Fixation should be individualized according to fracture morphology, bone quality, soft-tissue condition, patient activity, and the anticipated risk of implant-related complications.

Published

2024-09-30

How to Cite

Reda Hussein Mahmoud Hussein Elkady. (2024). Tension-Band Wiring Versus Plate Fixation for Olecranon Fractures: A Narrative Review. The International Journal of Multiphysics, 18(3), 6566 - 6580. Retrieved from https://mail.themultiphysicsjournal.com/index.php/ijm/article/view/2386

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